-
2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
-
2017,
Korolev YN, Mihajlik LV, Nikulina LA, Geniatulina MS
Vopr Kurortol Fizioter Lech Fiz Kult 94 (4): 54-58
-
2017,
Freschi F, Giaccone L, Cirimele V, Canova A
Phys Med Biol 63 (1): 015029
-
2017,
Zhang H, Gan L, Zhu X, Wang J, Han L, Cheng P, Jing D, Zhang X, Shan Q
Bone 107: 36-44
-
2017,
Zeni O, Simkó M, Scarfi MR, Mattsson MO
Front Public Health 5: 280
-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-1:2017: 1-86, ISBN 978-1-5044-4259-6
-
2017,
Ghatei N, Nabavi AS, Toosi MHB, Azimian H, Homayoun M, Targhi RG, Haghir H
Iran J Basic Med Sci 20 (9): 1037-1043
-
2017,
Capelli E, Torrisi F, Venturini L, Granato M, Fassina L, Lupo GFD, Ricevuti G
J Healthc Eng 2017: 2530270
-
2017 40th International Conference on Telecommunications and Signal Processing (TSP), Barcelona. IEEE; ISBN 978-1-5090-3983-8
-
2017,
Bhatt CR, Abramson MJ, Benke G
Aust N Z J Public Health 41 (6): 647-648