キーワード:
電磁界, "Elektromagnetisches Feld", EMF, "electromagnetic field"
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2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
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2023,
Martínez JA, Pancorbo M
Rev Environ Health [in press]
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2023,
Yin B, Joseph W, Deruyck M
IEEE Access 11: 115911-115923
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2023,
Baginska U, Moro A, Toonen RF, Verhage M
J Neurosci 43 (45): 7616-7625
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2023,
Gombarska D, Smetana M, Psenakova Z, Boleckova S
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: 1-4; ISBN 9798350330359
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2023,
Salameh M, Zeitoun-Ghandour S, Sabra L, Daher A, Khalil M, Joumaa WH
Sci Rep 13: 17806
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2023,
Prentice A, Barreiros AR, van der Vinne N, Stuiver S, van Dijk H, van Waarde JA, Korgaonkar M, Sack AT, Arns M
Neuropsychobiology 82 (6): 373-383
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2023,
Bodin R, Seewooruttun C, Corona A, Delanaud S, Pelletier A, Villégier AS
Environ Sci Pollut Res 30 (53): 113704-113717
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2023,
Tamura M, Kawamoto T, Ishifuro M, Tamura T, Masumoto Y, Kenjo M, Kiguchi M, Awai K, Nagata Y
J Med Syst 47 (1): 107
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Stem Cells Transl Med 12 (10): 631–650
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2023,
Li K, Hikage T, Masuda H, Ijima E, Nagai A, Taguchi K
Sci Rep 13: 17397
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2023,
Linnemann C, Sahin F, Chen Y, Falldorf K, Ronniger M, Histing T, Nussler AK, Ehnert S
Int J Mol Sci 24 (19): 14629
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2023,
Rahimi S, Ahrabi M, Samiei M, Roshangar L, Ahrabi B, Hashemi B, Shahi S, Rahimi Darehchi N
Iran Endod J 18 (4): 218-223
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2023,
Adda S, Chiaraviglio L, Franci D, Lodovisi C, Pasquino N, Pavoncello S, Pedroli C, Pelosini R
IEEE Trans Instrum Meas 72: 5504410
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2023,
Yang L, Wang B, Li Y
Front Inform Technol Elect Eng 24 (9): 1357-1365
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2023,
Sharma S, Sharma P, Bahel S, Singh J, Katnoria JK
Toxicol Environ Health Sci 15 (4): 385-398
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2023,
Benfedala S, Valero A, Brahmi F, Belbahi A, Kernou ON, Adjeroud-Abdellatif N, Abbou A, Madani K
Food Sci Technol Int [in press]
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2023,
Fu S, Yi S, Ke Q, Liu K, Xu H
ACS Nano 17 (20): 19652–19666
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2023,
Oraby T, Chakraborty S, Sivaganesan S, Kincl L, Richardson L, McBride M, Siemiatycki J, Cardis E, Krewski D
BMC Med Res Methodol 23: 225
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2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
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2023,
Mohamed T, Melfi V, Colciago A, Magnaghi V
Cell Death Dis 14 (9): 629
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: 1-6; ISBN 9798350301076