キーワード:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-5; ISBN 978-1-7281-0102-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 61 (6): 1935 - 1943
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2019,
Zhou Y, Zhang W, Yu H
Zhongguo Yi Liao Qi Xie Za Zhi 43 (2): 94-98
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2019,
Omi S, Uno T, Arima T, Wiart J
IEEE Trans Electromagn Compat 61 (1): 48 - 56
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2019,
Yang R, Zheng J, Wang Y, Guo R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (6): 1726 - 1732
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2019,
Ji X, Zheng J, Yang R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (1): 57 - 64
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2019,
Wang Q, Li W, Kang J, Wang Y
IEEE Trans Electromagn Compat 61 (6): 1913 - 1925
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2019,
Trigui A, Hached S, Ammari AC, Savaria Y, Sawan M
IEEE Rev Biomed Eng 12: 72-87
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2019,
Pfeifer S, Carrasco E, Crespo-Valero P, Neufeld E, Kühn S, Samaras T, Christ A, Capstick MH, Kuster N
IEEE Trans Electromagn Compat 61 (2): 476 - 486
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2019,
Xu B, Gustafsson M, Shi S, Zhao K, Ying Z, He S
IEEE Trans Electromagn Compat 61 (2): 327 - 336
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2019,
Ängskog P, Bäckström M, Samuelsson C, Kangashaka Vallhagen B
IEEE Trans Electromagn Compat 61 (3): 870 - 877
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2019,
Wang J, Li Q, Cai L, Zhou M, Xiao J, Šunjerga A
IEEE Trans Electromagn Compat 61 (2): 440 - 448
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2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: 187-192; ISBN 978-1-5386-6622-7
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2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Boston, MA, USA. IEEE: 783-784; ISBN 978-1-5386-7103-0
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2018,
Mengjun W, Jun Z, Hongxing Z, Mengjun W, Lulu C, Ze Y, Ping M, Hongxing Z
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 981-985; ISBN 978-1-5090-3955-5
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IEEE Electromagn Compat Mag 7 (1): 78-86
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2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 693-696; ISBN 978-1-5386-5063-9
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 24-27; ISBN 978-1-5090-3955-5
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2018,
Zradzinski P, Karpowicz J, Gryz K, Leszko W
Eskola H, Väisänen O, Viik J, Hyttinen J (eds.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, 65巻; Springer, Singapore; 1008-1011; ISBN 978-981-10-5121-0
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River Publishers Series in Communications; Shinohara N (ed.): River Publishers, Gistrup, Denmark; ISBN 978-87-93609-24-2
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2018,
Chen J, Ruddle AR, Xian Teo Y
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 860-865; ISBN 978-1-4673-9699-8
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2018,
Kaschel H, Ahumada C
2018 IEEE International Conference on Automation/XXIII Congress of the Chilean Association of Automatic Control (ICA-ACCA), Concepcion, Chile. IEEE: 1-8; ISBN 978-1-5386-5587-0
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2018,
Kaschel H, Ahumada C
2018 IEEE International Conference on Automation/XXIII Congress of the Chilean Association of Automatic Control (ICA-ACCA), Concepcion, Chile. IEEE: 1-6; ISBN 978-1-5386-5587-0