-
2020,
Yang C, Xu H, Wang R, Liu Y, Wang S
Ann Palliat Med 9 (5): 3357-3365
-
2020,
Adda S, Aureli T, Coltellacci S, D’elia S, Franci D, Grillo E, Pasquino N, Pavoncello S, Suman R, Vaccarono M
IEEE Access 8: 171956-171967
-
2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-6065-8
-
2020,
Supriya A, Ashok Kumar S, Shanmuganantham T
2020 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT), Bangalore, India. IEEE: pp. 1-3; ISBN 978-1-7281-6829-6
-
2020,
Oh JY, Lee YJ, Kim EH
Technol Cancer Res Treat 19: 1533033820947481
-
2020,
Magiera A, Solecka J
Rocz Panstw Zakl Hig 71 (3): 251-259
-
2020,
Yahyazadeh A, Altunkaynak BZ
Biomed Environ Sci 33 (8): 593-602
-
2020,
Eggert T, Dorn H, Sauter C, Schmid G, Danker-Hopfe H
Environ Res 191: 110173
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 270-275; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 261-265; ISBN 978-1-7281-7431-0
