-
2019,
Rohde M, Ziebart J, Kirschstein T, Sellmann T, Porath K, Kühl F, Delenda B, Bahls C, van Rienen U, Bader R, Köhling R
Front Bioeng Biotechnol 7: 422
-
2019,
Vaessen EMJ, Timmermans RAH, Tempelaars MH, Schutyser MAI, den Besten HMW
Sci Rep 9: 19990
-
2019,
Li C, Liu C, Yang L, He L, Wu T
Biomed Res Int 2019: 9461018
-
2019,
Michalowska J, Jozwik J, Tofil A
2019 IEEE 5th International Workshop on Metrology for AeroSpace (MetroAeroSpace), Torino, Italy. IEEE: 366-370; ISBN 978-1-7281-1345-6
-
2019,
Lorenzo MF, Thomas SC, Kani Y, Hinckley J, Lee M, Adler J, Verbridge SS, Hsu FC, Robertson JL, Davalos RV, Rossmeisl Jr JH
Cancers 11 (12): E1850
-
2019 Open Innovations (OI), Cape Town, South Africa. IEEE: 222-225; ISBN 978-1-7281-3465-9
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
-
2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
Adv Wound Care 8 (4): 136-148
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6