著者:
Feng Z, Diao Y, Sun W, He Y, Leung PSW
掲載誌: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE, 2019: pp. 48-51; ISBN 978-1-7281-1639-6