キーワード:
"elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Swiss Federal Office of Energy (SFOE),
Statusbericht 2017: 1-125
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Mishra SK, Chowdhary R, Kumari S, Rao SB
J Clin of Diagn Res 11 (5): ZE01-ZE05
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2017,
Capstick MH, Kuehn S, Berdinas-Torres V, Gong Y, Wilson PF, Ladbury JM, Koepke G, McCormick DL, Gauger J, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (4): 1041-1052
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2017,
Gong Y, Capstick M, Kuehn S, Wilson P, Ladbury J, Koepke G, McCormick DL, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (6): 1798-1808
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2017,
Takei R, Nagaoka T, Saito K, Watanabe S, Takahashi M
IEEE Trans Electromagn Compat 59 (2): 747-753
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2017,
Wake K, Laakso I, Hirata A, Chakarothai J, Onishi T, Watanabe S, De Santis V, Feliziani M, Taki M
IEEE Trans Electromagn Compat 59 (2): 677 - 685