キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2009,
Trinchero D, Stefanelli R, Longobardi F, Galardini A, Fiorelli B, D'Amore G, Anglesio L, Benedetto A, Trinchero S, Borsero M, Vizio G
IEEE Antennas Wirel Propag Lett 8: 224-227
-
2009,
Bottauscio O, Chiampi M, Pastorelli M, Pons E, Zilberti L
2009 13th European Conference on Power Electronics and Applications, Barcelona, Spain. IEEE: pp. 1-10; ISBN 978-1-4244-4432-8
-
2009,
Capstick M, Kuster N, Kühn S, Berdinas-Torres V, Ladbury J, Koepke G, McCormick D, Gauger J, Melnick R
Proceedings of the Cranfield Multi-Strand Conference: Creating Wealth Through Research and Innovation, CMC 2008. Cranfield University: pp. 533-538; ISBN 978-0-9557436-7-2
-
2009,
Becerra M, Cooray V
IEEE Trans Electromagn Compat 51 (4): 1001-1008
-
2009,
Hille S, Eichhorn KF, Gonschorek KH
2009 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA. IEEE: pp. 147-152; ISBN 978-1-4244-4266-9
-
2009,
Davis CC, Balzano Q
IEEE Trans Electromagn Compat 51 (2): 210-216
-
2009,
Gosselin MC, Christ A, Kühn S, Kuster N
IEEE Trans Electromagn Compat 51 (2): 227-235
-
2008,
Pisa S, Calcagnini G, Cavagnaro M, Piuzzi E, Mattei E, Bernardi P
IEEE Trans Electromagn Compat 50 (1): 35-42
-
IEEE Trans Electromagn Compat 50 (2): 316-324
-
2008,
Nagaoka T, Saito K, Takahashi M, Ito K, Watanabe S
International Symposium on Electromagnetic Compatibility - EMC Europe, Hamburg, 2008. IEEE; ISBN 978-1-4244-4097-9