キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522; ISBN 978-1-5090-3955-5
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Poljak D, Cvetković M, Bottauscio O, Hirata A, Laakso I, Neufeld E, Reboux S, Warren C, Giannopolous A, Costen F
IEEE Trans Electromagn Compat 60 (2): 328 - 337
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2017,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 59 (2): 686-694
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2017,
Jin L, Peng C, Jiang T
IEEE Trans Electromagn Compat 59 (4): 1095-1102
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2017,
Vargova B, Kurimsky J, Cimbala R, Kosterec M, Majlath I, Pipova N, Tryjanowski P, Jankowiak L, Majlathova V
Syst Appl Acarol 22 (5): 683-693
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2017,
Bulut F, Efendioglu HS, Solak V, Yabuloglu M, Özer H
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey: 1-3; ISBN 978-1-5090-4821-2
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2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: 1-5; ISBN 978-1-5090-5186-1