キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2021,
Chan G, Lee CC, Wei Y, Tsang KF
2021 IEEE International Symposium on Product Compliance Engineering - Asia (ISPCE-ASIA), Taipei, Taiwan. IEEE: pp. 01-06; ISBN 978-1-6654-4343-2
-
2021,
Yang C, Schierholz M, Trunczik E, Helmich LM, Brüns HD, Schuster C
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 697-702; ISBN 978-1-6654-4889-5
-
German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN IEC 61980-1:2021-09 VDE 0122-10-1:2021-09
-
2021,
Das M, Vogt-Ardatjew R, Van den Berg B, Leferink F
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 857-861; ISBN 978-1-6654-4889-5
-
2021,
Song X, Li R, Yue Y, Wan S
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
-
2021,
Adegbola R, Fifatin FX, Agbokpanzo R, Acakpovi A
2021 IEEE 8th International Conference on Adaptive Science and Technology (ICAST), Accra, Ghana. IEEE: pp. 1-6; ISBN 978-1-6654-2718-0
-
2021,
Evangelista J, Loschi H, Costa ET, Smolenski R, Moonen N, Vogt-Ardatjew R
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
-
2021,
Ardiatna W, Nugroho HW, Hidayat SW, Sukma I, Supono I, Mandaris D
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Nusa Dua - Bali, Indonesia. IEEE: pp. 1-4; ISBN 978-1-7281-7622-2
-
2021,
Diao Y, Li K, Sasaki K, Kodera S, Laakso I, El Hajj W, Hirata A
IEEE Trans Electromagn Compat 63 (5): 1709-1716
-
2021,
De Miguel-Bilbao S, Hernandez JA, Suarez OJ, Marina P, Febles VM, Rabassa LE, Suarez S, Karpowicz J, Zradzinski P, Gryz K, Aguirre E, Ramos V
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: pp. 13-18; ISBN 978-1-6654-4889-5
