キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Houran MA, Yang X, Chen W, Samizadeh M
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), Niigata, Japan. IEEE: 1062-1066; ISBN 978-1-5386-4190-3
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2018,
He W, Gao Z, Zhang W
Zhongguo Yi Liao Qi Xie Za Zhi 42 (5): 372-374
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2018,
Kurta E, Kovačević Ž, Gurbeta L, Badnjević A
2018 7th Mediterranean Conference on Embedded Computing (MECO), Budva, Montenegro. IEEE: 1-4; ISBN 978-1-5386-5684-6
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2018,
Paganoto PS, Hagedorn MP, da Silva JR
2017 IEEE 3rd Global Electromagnetic Compatibility Conference (GEMCCON), Sao Paulo, Brazil. IEEE: 1-5; ISBN 978-1-5386-2992-5
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2018,
Kosterec M, Kurimský J, Vargová B
2018 19th International Scientific Conference on Electric Power Engineering (EPE), Brno, Czech Republic. IEEE: 1-6; ISBN 978-1-5386-4613-7
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94; ISBN 978-1-5090-3955-5
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 331-335; ISBN 978-1-5090-3955-5
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 1267-1273; ISBN 978-1-5090-3955-5
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 936-939; ISBN 978-1-5090-3955-5
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522; ISBN 978-1-5090-3955-5
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Poljak D, Cvetković M, Bottauscio O, Hirata A, Laakso I, Neufeld E, Reboux S, Warren C, Giannopolous A, Costen F
IEEE Trans Electromagn Compat 60 (2): 328 - 337
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2017,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 59 (2): 686-694
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2017,
Jin L, Peng C, Jiang T
IEEE Trans Electromagn Compat 59 (4): 1095-1102
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2017,
Vargova B, Kurimsky J, Cimbala R, Kosterec M, Majlath I, Pipova N, Tryjanowski P, Jankowiak L, Majlathova V
Syst Appl Acarol 22 (5): 683-693
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2017,
Bulut F, Efendioglu HS, Solak V, Yabuloglu M, Özer H
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey: 1-3; ISBN 978-1-5090-4821-2
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2017,
Rumeng T, Senwen L, Tong W, Shaochuan C
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE: 1-5; ISBN 978-1-5090-5186-1
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2017,
Park J, Kim D, Hwang K, Park HH, Kwak SI, Kwon JH, Ahn S
IEEE Trans Electromagn Compat 59 (2): 695 - 703
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2017,
Masumnia-Bisheh K, Ghaffari-Miab M, Zakeri B
IEEE Trans Electromagn Compat 59 (2): 509 - 517
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2017,
Yavolovskaya E, Gabriadze G, Chiqovani G, Jobava R
2017 XXIInd International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Dnipro. IEEE, Dnipro, Ukraine: 183-186; ISBN 978-1-5090-0605-2
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2017,
Gercek C, Magne I, Kourtiche D, Schmitt P, Roth P, Nadi M, Souques M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France: 1-5; ISBN 978-1-5386-0689-6
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2017,
Campi T, Cruciani S, De Santis V, Maradei F, Feliziani M
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France: 1-6; ISBN 978-1-5386-0689-6