-
2022,
Kim D, Kim M, Lee S, Lee Y, Kim Y
2022 9th International Conference on Condition Monitoring and Diagnosis (CMD), Kitakyushu, Japan. IEEE: pp. 687-690; ISBN 978-1-6654-7015-5
-
2022,
Asha Banu SM, Niresh Kumar K, Mohamed Faizal M, Murugananda Sri Sabari Vasan S
2022 4th International Conference on Inventive Research in Computing Applications (ICIRCA), Coimbatore, India. IEEE: pp. 1-8; ISBN 978-1-6654-9708-4
-
2022,
Nishikawa T, Hikage T, Yamamoto M
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 124-125; ISBN 978-1-6654-3239-9
-
2022,
Sekiya K, Ishii N, Shimizu Y, Nagaoka T
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 79-80; ISBN 978-1-6654-3239-9
-
2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: pp. 37-38; ISBN 978-1-6654-3239-9
-
2022,
Zhou H, Zhang R, Tian Y, Peng H, Wang H, Mao J
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA. IEEE: pp. 1-3; ISBN 978-1-6654-9195-2
-
2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: pp. 1-6; ISBN 978-1-6654-7147-3
-
2022,
Jitsakulchaidej P, Wivatvongvana P, Kitisak K
BMC Neurol 22: 510
-
2022,
Baur D, Ermolova M, Souza VH, Zrenner C, Ziemann U
Brain Stimul 15 (6): 1508-1510
-
J Cosmet Dermatol 21 (11): 5657-5664
