キーワード:
"Institute of Electrical and Electronics Engineers", IEEE, 米国電気電子学会
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2020,
Zada M, Shah IA, Yoo H
IEEE Trans Antennas Propag 68 (2): 1140-1144
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2020,
Alipour A, Meyer ES, Dumoulin C, Watkins R, Elahi H, Loew W, Schweitzer J, Olson G, Chen Y, Tau S, Guttman M, Kolandaivelu A, Halperin H, Schmidt E
IEEE Trans Biomed Eng 67 (6): 1616-1627
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2020,
De Lellis P, Lo Iudice F, Pasquino N
IEEE Trans Instrum Meas 69 (6): 3198-3205
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IEEE J Electromagn RF Microw Med Biol 4 (3): 157-163
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2020,
Liorni I, Lisewski T, Capstick MH, Kuehn S, Neufeld E, Kuster N
IEEE Trans Electromagn Compat 62 (4): 1323-1332
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2020,
Garcia-Sanchez T, Mercadal B, Polrot M, Muscat A, Sarnago H, Lucia O, Mir LM
IEEE Trans Biomed Eng 67 (4): 1040-1049
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2020,
Wasilewski J, Parol M, Jakubowski J
IEEE Transactions on Power Delivery 35 (2): 600 - 608
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2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
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2020,
Jamshed MA, Heliot F, Brown T
IEEE J Electromagn RF Microw Med Biol 4 (1): 24 - 36
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2020,
Romeo S, Sannino A, Zeni O, Angrisani L, Massa R, Scarfi MR
IEEE J Electromagn RF Microw Med Biol 4 (1): 17-23
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2020,
Attaran A, Handler WB, Chronik BA
IEEE J Electromagn RF Microw Med Biol 4 (1): 2 - 9
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2020,
Attaran A, Handler WB, Chronik BA
IEEE Trans Electromagn Compat 62 (1): 186 - 193
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IEEE Trans Electromagn Compat 62 (2): 338-345
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2020,
Serralles JE, Giannakopoulos I, Zhang B, Ianniello C, Cloos MA, Polimeridis AG, White JK, Sodickson DK, Daniel L, Lattanzi R
IEEE Trans Biomed Eng 67 (1): 3 - 15
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2019,
Parchin NO, Al-Yasir YIA, Basherlou HJ, Abdulkhaleq AM, Sajedin M, Abd-Alhameed RA, Noras JM
2019 IEEE 2nd 5G World Forum (5GWF), Dresden, Germany. IEEE: pp. 199-203; ISBN 978-1-7281-3628-8
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2019,
Seward WG, Huxtable RD, Beynon BP, Zvirblys A, Camacho-Hunt NJ, Albano M, Cipcigan LM
2019 54th International Universities Power Engineering Conference (UPEC), Bucharest, Romania. IEEE: pp. 1-6; ISBN 978-1-7281-3350-8
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2019,
Li X, Gong H, Pan JW, Hetherington HP, Rispoli JV
2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain. IEEE: pp. 1291-1295; ISBN 978-1-7281-0564-2
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IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
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2019,
Lee CS, Bai B, Song QR, Wang ZQ, Li GF
IEEE Trans Microw Theory Tech 67 (12): 5417-5428
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2019,
Yamanaka D, Takahashi M
2019 Wireless Days (WD), Manchester, UK. IEEE: pp. 1-4; ISBN 978-1-7281-0118-7
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2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 2538-2546; ISBN 978-1-7281-3404-8
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2019,
Motovilova E, Huang SY
IEEE Trans Microw Theory Tech 67 (2): 615-625
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2019,
Masumnia-Bisheh K, Furse C
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 217-218; ISBN 978-1-7281-0693-9
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2019,
Raj AB, Nesasudha M
2019 2nd International Conference on Signal Processing and Communication (ICSPC), Coimbatore, India. IEEE: pp. 193-197; ISBN 978-1-7281-1850-5
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2019,
Ortego-Isasa I, Martins A, Birbaumer N, Ramos-Murguialday A
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, CA, USA. IEEE: pp. 381-384; ISBN 978-1-5386-7922-7