-
2019,
Sasi kumar JVS, Kumar P S, Ranjan P, Arava S, Kalyan KP, Sai chand T
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: pp. 1-3; ISBN 978-1-5386-9354-4
-
2019,
Brinda K, Kumar Palaniswamy S, Priyadharshini N, Keerthi C S, Prasanth DS, Agarwal R
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: pp. 1-4; ISBN 978-1-5386-9354-4
-
2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 198-201; ISBN 978-1-7281-2570-1
-
2019,
Ji X, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 527-528; ISBN 978-1-7281-0693-9
-
2019,
Le DT, Li K, Watanabe S, Onishi T
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 523-524; ISBN 978-1-7281-0693-9
-
2019,
Ebadi-Shahrivar A, Fay P, Hochwald BM, Love DJ
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 1005-1006; ISBN 978-1-7281-0693-9
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
-
2019,
Lee HK, Ahn SJ, Shin YM, Kang N, Cauraugh JH
J Neuroeng Rehabil 16: 139
-
2019,
Morya E, Monte-Silva K, Bikson M, Esmaeilpour Z, Biazoli Jr CE, Fonseca A, Bocci T, Farzan F, Chatterjee R, Hausdorff JM, da Silva Machado DG, Brunoni AR, Mezger E, Moscaleski LA, Pegado R, Sato JR, Caetano MS, Sá KN, Tanaka C, Li LM, Baptista AF, Okano AH
J Neuroeng Rehabil 16: 141
-
2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6