-
2023,
Markus I, Ohayon E, Constantini K, Geva-Kleinberger K, Ibrahim R, Ruban A, Gepner Y
Int J Mol Sci 24 (17): 13463
-
2023,
Vivarelli C, Censi F, Calcagnini G, De Ruvo E, Calò L, Mattei E
Int J Environ Res Public Health 20 (5): 4512
-
2023,
Huber P, Mohanty P, Jenau F
2023 IEEE Electrical Insulation Conference (EIC), Quebec City, QC, Canada. IEEE: pp. 1-4; ISBN 978-1-6654-9342-0
-
2023,
Zhang L, Malkemper EP
Front Physiol 14: 1250798
-
2023,
Ejaz A, Jabeen I, Khan ZU, Alomainy A, Aljaloud K, Alqahtani AH, Hussain N, Hussain R, Amin Y
Micromachines 14 (6): 1169
-
2023,
Mayer Y, Khoury J, Horwitz J, Ginesin O, Canullo L, Gabay E, Giladi HZ
Bioelectromagnetics 44 (7-8): 144-155
-
2023,
Cordelli E, Ardoino L, Benassi B, Consales C, Eleuteri P, Marino C, Sciortino M, Villani P, Brinkworth MH, Chen G, McNamee JP, Wood AW, Belackova L, Verbeek J, Pacchierotti F
Environ Int 180: 108178
-
2023,
Horváth P, Pávó J, Badics Z, Horváth BP
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1914-1920; ISBN 9798350312850
-
2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1389-1396; ISBN 9798350312850
-
2023,
Ghosh D, Nandi A, Chakraborty U
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: pp. 1368-1374; ISBN 9798350312850