-
2019,
Diao Y, Gomez-Tames J, Rashed EA, Kavet R, Hirata A
IEEE Access 7: 184320-184331
-
2019,
Zhang J, Liu Y, Cui C, Wang Z, Cui S, Zhu C
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: pp. 1-5; ISBN 978-1-7281-3399-7
-
2019,
Shen YM, Qin FJ, Du WL, Wang C, Zhang C, Chen H, Ma CX, Hu XH
Zhonghua Shao Shang Za Zhi 35 (11): 776-783
-
2019,
Wen YZ, Zhang PH, Ren LC, Zhang MH, Zeng JZ, Zhou J, Liang PF, Huang XY
Zhonghua Shao Shang Za Zhi 35 (11): 784-789
-
2019,
Kryukov AI, Kunelskaya NL, Shershunova EA, Rebrov IE, Yamshchikov VA, Garov EV, Tsarapkin GY, Mishchenko VV
Vestn Otorinolaringol 84 (5): 6-14
-
2019,
Fadhilah I, Amin MM
Open Access Maced J Med Sci 7 (16): 2667-2670
-
2019,
Arnold CE, Rajnicek AM, Hoare JI, Pokharel SM, McCaig CD, Barker RN, Wilson HM
Sci Rep 9: 17604
-
2019,
Fernández-Rodríguez C, Bulla G, de Salles AA
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: pp. 264-267; ISBN 978-1-7281-1798-0
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
