-
2014,
Teismann H, Wollbrink A, Okamoto H, Schlaug G, Rudack C, Pantev C
PLoS One 9 (2): e89904
-
2014,
El-Bediwi AB, El-Fallal A, Saker S, Ozcan M
J Adhes Dent 16 (5): 407-413
-
2014,
Stirke A, Zimkus A, Balevicius S, Stankevic V, Ramanaviciene A, Ramanavicius A, Zurauskiene N
Appl Phys Lett 105 (25): 253701
-
2014,
Devasia T, Nandra A, Kareem H, Manu MK, Thakkar AS
Int J Clin Med 5 (5): 167-170
-
2014,
Qi W, Guo J, Wu S, Su B, Zhang L, Pan J, Zhang J
Oncol Rep 31 (5): 2220-2228
-
2014,
Gao YH, Cheng K, Ge BF, Zhen P, Zhou J, Ma XN, Li SF, Chen KM
Zhongguo Gu Shang 27 (11): 933-937
-
2014,
Chen F, Qi H, Ming D, Zhou P
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: 2613-2616; ISBN 978-1-4244-7929-0
-
2014,
Lv B, Su C, Yang L, Xie Y, Wu T
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: 986-989; ISBN 978-1-4244-7929-0
-
2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1
-
2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 162-165; ISBN 978-4-88552-287-1