-
2023,
Venkatachalam D, Jagadeesan V, Ismail KBM, Arun Kumar M, Mahalingam S, Kim J
Bioengineering 10 (10): 1137
-
Appl Sci 13 (19): 10621
-
2023,
Bidgoli HA, Schieda N, Rossa C
2023 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Regina, SK, Canada. IEEE: pp. 94-98; ISBN 9798350323986
-
2023,
Ma Y, Wang N, Li K, Liang H, Bai J, Ji X
Skin Res Technol 29 (10): e13472
-
GSM Association (GSMA), Mobile & Wireless Forum (MWF),
1-36
-
Diritti Umani Diritto Int 17 (2): 375-404
-
2023,
Hernandez D, Kim D, Nam T, Jeong Y, Seo M, Lee E, Kim J, Kim KN
IEEE Access 11: 120438-120448
-
2023,
Heo DH, Park DY, Hong YH, Kim D, Kim JS
Eur Spine J 32 (8): 2769-2775
-
2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
-
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: pp. 1-4; ISBN 9798350330359
-
2023,
Baginska U, Moro A, Toonen RF, Verhage M
J Neurosci 43 (45): 7616-7625
-
2023,
Gombarska D, Smetana M, Psenakova Z, Boleckova S
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: pp. 1-4; ISBN 9798350330359
-
2023,
Bodin R, Seewooruttun C, Corona A, Delanaud S, Pelletier A, Villégier AS
Environ Sci Pollut Res 30 (53): 113704-113717
-
2023,
Tamura M, Kawamoto T, Ishifuro M, Tamura T, Masumoto Y, Kenjo M, Kiguchi M, Awai K, Nagata Y
J Med Syst 47 (1): 107
-
2023,
Chen YH, Liang SC, Sun CK, Cheng YS, Tzang RF, Chiu HJ, Wang MY, Cheng YC, Hung KC
BMC Psychiatry 23: 756
-
2023,
Gross D, Scandling B, Leewood AR, Simonetti OP
Biomed Phys Eng Express 9 (6): 065025
-
2023,
Sharbafshaaer M, Gigi I, Lavorgna L, Esposito S, Bonavita S, Tedeschi G, Esposito F, Trojsi F
J Clin Med 12 (19): 6190
-
2023,
Li K, Hikage T, Masuda H, Ijima E, Nagai A, Taguchi K
Sci Rep 13: 17397
-
2023,
Akbari H, Taghavi L, Hossaini SKE, Gholami-Fesharaki M, Mirzahosseini SAH
Trauma Mon 28 (4): 876-881
-
2023,
Guo M, Wang T, Zhang T, Zhai H, Xu G
Med Biol Eng Comput 61 (12): 3209-3223
-
2023,
Yang L, Wang B, Li Y
Front Inform Technol Elect Eng 24 (9): 1357-1365
-
2023,
Sharma S, Sharma P, Bahel S, Singh J, Katnoria JK
Toxicol Environ Health Sci 15 (4): 385-398
-
2023,
Chen B, Dammann P, Jabbarli R, Sure U, Quick HH, Kraff O, Wrede KH
PLoS One 18 (10): e0292666
-
2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
-
2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
