2024,
Touroutoglou A, Katsumi Y, Rezaii N, Paranhos T, Jones A, Hochberg D, Quimby M, Henderson SK, Wong B, Brickhouse M, Camprodon JA, Dickerson BC, Eldaief MC
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400
2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400