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Ji GJ, Wei JJ, Liu T, Li D, Zhu C, Yu F, Tian Y, Wang K, Zhang L, Hu P
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6