-
2020,
Lee MR, Caparelli EC, Leff M, Steele VR, Maxwell AM, McCullough K, Salmeron BJ
Neuromodulation 23 (3): 384-392
-
2020,
Henssen D, Giesen E, van der Heiden M, Kerperien M, Lange S, Van Cappellen van Walsum AM, Kurt E, van Dongen R, Schutter D, Vissers K
Neurosci Lett 719: 134489
-
2020,
Allan BB, Bell S, Husarek K
J Womens Health 29 (3): 383-389
-
2020,
Bainbridge C, Clites BL, Caldart CS, Palacios B, Rollins K, Golombek DA, Pierce JT, Vidal-Gadea AG
J Comp Physiol A 206 (3): 343-352
-
2020,
Stockly OR, Wolfe AE, Espinoza LF, Simko LC, Kowalske K, Carrougher GJ, Gibran N, Bamer AM, Meyer W, Rosenberg M, Rosenberg L, Kazis LE, Ryan CM, Schneider JC
Burns 46 (2): 352-359
-
2020,
He Y, Li K, Chen Q, Yin J, Bai D
Am J Phys Med Rehabil 99 (2): 99-108
-
2020,
Hofstoetter US, Freundl B, Danner SM, Krenn MJ, Mayr W, Binder H, Minassian K
J Neurotrauma 37 (3): 481-493
-
2020,
Dechent D, Emonds T, Stunder D, Schmiedchen K, Kraus T, Driessen S
Burns 46 (2): 267-278
-
2020,
Oka H, Miki K, Kishita I, Kong DF, Uchida T
Pain Med 21 (2): 326-332
-
2020,
Hadar R, Winter R, Edemann-Callesen H, Wieske F, Habelt B, Khadka N, Felgel-Farnholz V, Barroeta-Hlusicka E, Reis J, Tatarau CA, Funke K, Fritsch B, Bernhardt N, Bikson M, Nitsche MA, Winter C
Mol Psychiatry 25 (4): 896-905
-
2019,
Rahman AA, Kamardin K, Yamada Y
2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), Melacca, Malaysia. IEEE: 1-5; ISBN 978-1-7281-2163-5
-
2019,
Bird R, Naji S, Vowles B, Shaw A, Martin NA
Trauma 21 (4): 317-320
-
2019,
Shabeeb Ahamed KP, Ram TS, Arunachalam K
2019 URSI Asia-Pacific Radio Science Conference (AP-RASC), New Delhi, India. IEEE: 1-4; ISBN 978-1-5386-8551-8
-
2019,
Islam T, Begum HA, Rahman MA, Ahsan T, Alam MS, Alam T, Sobuz MS, Islam MT
2018 International Conference on Innovations in Science, Engineering and Technology (ICISET), Chittagong, Bangladesh. IEEE: 447-450; ISBN 978-1-5386-8525-9
-
2019,
Manoufali M, Bialkowski K, Mohammed B, Mills PC, Abbosh AM
IEEE Trans Antennas Propag 67 (8): 4955-4967
-
2019,
Miah MS, Khan AN, Icheln C, Haneda K, Takizawa KI
IEEE Trans Antennas Propag 67 (4): 2687-2699
-
2019,
Shafaet-Uz-Zaman K, Matin MA
2019 TEQIP III Sponsored International Conference on Microwave Integrated Circuits, Photonics and Wireless Networks (IMICPW), Tiruchirappalli, India. IEEE: 10-14; ISBN 978-1-7281-1882-6
-
2019,
Byron K, Winkler SA, Robb F, Vasanawala S, Pauly J, Scott G
IEEE Trans Microw Theory Tech 67 (5): 1717-1726
-
2019,
Tan L, Tang Z, Zhong R, Huang X, Liu H, Chen C
IEEE Access 7: 151733-151745
-
2019,
Asif SM, Iftikhar A, Braaten BD, Ewert DL, Maile K
IEEE Access 7: 31031-31042
-
2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 78-81; ISBN 978-1-7281-1639-6
-
2019,
Mohanarangam K, Kim MG, Choi JR
2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland. IEEE: 145-148; ISBN 978-1-7281-1202-2
-
2019,
Konefal-Janocha M, Banas-Zabczyk A, Bester M, Bocak D, Budzik S, Gorny S, Larsen S, Majchrowski K, Cholewa M
Pol J Environ Stud 28 (2): 709-715
-
2019,
Rifna EJ, Ratish Ramanan K, Mahendran R
Trends Food Sci Technol 86: 95-108
-
2019,
Dziwulska-Hunek A, Cwintal M, Niemczynowicz A, Boron B, Matwijczuk A
Pol J Environ Stud 28 (5): 3133-3143