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Zerbinati N, d'Este E, Cornaglia AI, Riva F, Farina A, Calligaro A, Gallo G, Perrotta ER, Protasoni M, Bonan P, Vojvodic A, Fioranelli M, Thuong NV, Lotti T, Tirant M, Vojvodic P
Open Access Maced J Med Sci 7 (18): 2991-2997
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2019,
Kobylkov D, Wynn J, Winklhofer M, Chetverikova R, Xu J, Hiscock H, Hore PJ, Mouritsen H
J R Soc Interface 16 (161): 20190716
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2019,
Michałowska J, Tofil A, Józwik J, Pytka J, Legutko S, Siemiątkowski Z, Łukaszewicz A
Sensors 19 (24): E5537
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2019,
Chen J, Tu C, Tang X, Li H, Yan J, Ma Y, Wu H, Liu C
Stem Cell Res Ther 10: 379
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2019,
Diao Y, Gomez-Tames J, Rashed EA, Kavet R, Hirata A
IEEE Access 7: 184320-184331
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2019,
Poljak D, Pajewski L
2019 URSI International Symposium on Electromagnetic Theory (EMTS), San Diego, CA, USA. IEEE: 1-2; ISBN 978-1-5386-5593-1
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2019,
Kwate RK, Derkaoui A, Elmagroud B, Taybi C, Ziyyat A, Picard D
2019 7th Mediterranean Congress of Telecommunications (CMT), Fez, Morocco. IEEE: 1-4; ISBN 978-1-7281-4421-4
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2019,
Shtoda D, Mustetsov M
2019 IEEE 2nd Ukraine Conference on Electrical and Computer Engineering (UKRCON), Lviv, Ukraine. IEEE: 239-243; ISBN 978-1-7281-3883-1
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2019,
Nykyforov V, Yelizarov M, Sakun O, Pasenko A, Maznytska O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: 514-517; ISBN 978-1-7281-2570-1
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2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: 210-212; ISBN 978-1-7281-4263-0