-
Microw and Opt Tech Letters 61 (6): 1482-1490
-
2019,
Jovanovic DB, Stankovic V, Cvetkovic NN, Krstic D, Vuckovic D
Compel - Int J Comp Math Electr Electron Eng 38 (5): 1465-1479
-
2019,
Khaleel YA, Yahya SI, Ibrahim RK
Aro-The Scientific Journal of Koya University 7 (2): 63-68
-
2019,
Bhargava D, Leeprechanon N, Rattanadecho P, Wessapan T
Int J Heat Mass Transf 130: 1178-1188
-
German Social Accident Insurance (DGUV),
IFA Report, 1/2019: 1-211, ISBN 978-3-86423-237-4
-
2019,
Iatcheva I, Saykova I
2019 19th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF), Nancy, France. IEEE: pp. 1-2; ISBN 978-1-7281-1561-0
-
2019,
Kothawala AA, Baskaran D, Arunachalam K, Thittai AK
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 6387-6390; ISBN 978-1-5386-1312-2
-
2019,
Mescia L, Chiapperino MA, Bia P, Lamacchia CM, Gielis J, Caratelli D
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 2992-2998; ISBN 978-1-7281-3404-8
-
2019,
Hu C, Fan X, He L, Li X, Tong L
2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: pp. 1727-1731; ISBN 978-1-7281-1676-1
-
2019,
Delfino JG, Krainak DM, Flesher SA, Miller DL
Med Phys 46 (12): 5562-5571
