-
2020,
Bhargava D, Rattanadecho P, Wessapan T
Case Studies in Thermal Engineering 22: 100789
-
2020,
Gas P, Miaskowski A, Subramanian M
Int J Mol Sci 21 (22): E8597
-
2020,
Sales MVG, Lima BS, Acosta-Avalos D
Eur Biophys J 49 (7): 633-642
-
2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
-
2020,
Bridges M, Khalily M, Abedian M, Serghiou D, Xiao P, Tafazolli R
2020 International Conference on UK-China Emerging Technologies (UCET), Glasgow, United Kingdom. IEEE: pp. 1-4; ISBN 978-1-7281-9489-9
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 261-265; ISBN 978-1-7281-7431-0
-
2020,
Wang B, Li J, Jin H, Chen X
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: pp. 2516-2519; ISBN 978-1-7281-1991-5
-
2020,
Bushberg JT, Chou CK, Foster KR, Kavet R, Maxson DP, Tell RA, Ziskin MC
Health Phys 119 (2): 236-246
-
2020,
Gultekin DH, Siegel PH
IEEE Access 8: 115593-115612
-
2020,
Khodarahmi I, Bonham LW, Weiss CR, Fritz J
Invest Radiol 55 (6): 396-404
