-
2018,
Samoudi AM, Tanghe E, Martens L, Joseph W
Biomed Res Int 2018: 7061420
-
2018,
Yang J, Meng X, Dong D, Xue Y, Chen X, Wang S, Shen Y, Zhang G, Shang P
Bone 114: 235-245
-
Data Brief 17: 920-925
-
2018,
Dreyer D, Frost B, Mouritsen H, Günther A, Green K, Whitehouse M, Johnsen S, Heinze S, Warrant E
Curr Biol 28 (13): 2160-2166.e5
-
2018,
Pal A, Kumar S, Jain S, Nag TC, Mathur R
J Nanosci Nanotechnol 18 (10): 6756-6764
-
2018,
Nakagawa H, Ohuchi M
IEEE Trans Magn 54 (11): 5000405
-
2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 1267-1273; ISBN 978-1-5090-3955-5
-
2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 872-874; ISBN 978-1-5090-3955-5
-
2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 936-939; ISBN 978-1-5090-3955-5
-
2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: pp. 518-522; ISBN 978-1-5090-3955-5