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2211件の論文が見つかりました。

キーワード: Hochspannung, "high voltage", 高電圧

• 2018, Lackovic I
  Modeling of Joule heating in tissues induced by high- and low-voltage pulse combinations for gene electrotransfer [tech./dosim.]
  2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: pp. 1-2; ISBN 978-1-5386-5922-9
• 2018, Cieslar G, Sowa P, Sieron K, Sieron A
  Impact of chronic exposure to static, high voltage electric field generated nearby HVDC transmission lines on behavior of rats [med./bio.]
  2018 Baltic URSI Symposium (URSI), Poznan, Poland. IEEE: pp. 5-6; ISBN 978-1-5386-1360-3
• 2018
  [Arc welding equipment - Part 1: Welding power sources (IEC 60974-1:2017); German version EN IEC 60974-1:2018] [guideline]
  German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE), DIN EN IEC 60974-1:2018-12 VDE 0544-1:2018-12
• 2018, Jeyakumar P, Hussain AT, Ahamed AR
  [電撃熱傷後の骨の露出を伴う大規模な頭皮欠損の再構成：12症例の研究] [med. app.]
  Ann Plast Surg 81 (1): 39-44
• 2018, Li M, Wu Y, Zhang M, Zhua J
  [高電圧静電界はトマト苗の窒素吸収を増加させ、成長を改善する] [med./bio.]
  Can J Plant Sci 98 (1): 93-106
• 2018
  [詳細] [ネットワーク事業者の作業者の電力周波数電磁界へのばく露限度の遵守のための評価技法及び作業手順] [guideline]
  International Telecommunication Union (ITU), ITU-T Recommendations K-Series, K.90 (07/2018): 1-28
• 2018, Ichikawa N
  [日本における2012-2014年の電気的死亡率及び感電死の疫学] [elec. inj.]
  2018 IEEE IAS Electrical Safety Workshop (ESW), Fort Worth, TX, USA. IEEE: pp. 1-8; ISBN 978-1-5386-1560-7
• 2018, Kuznetsov B, Bovdui AVI, Vinichenko E, Kobilyanskiy B, Nikitina T
  [単一の補償コイルを用いた能動的遮へい対策による高圧電力線の磁界低減] [tech./dosim.]
  2017 International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 196-199; ISBN 978-1-5386-1751-9
• 2018, Ryan HA, Hirakawa S, Yang E, Zhou C, Xiao S
  [細胞応答の変調のための高電圧、多層、ナノ秒パルス] [tech./dosim.]
  IEEE Trans Biomed Circuits Syst 12 (2): 338 - 350
• 2018, Schwartz S, Thompson GL
  [椎間板組織の非熱的電気穿孔を予測する] [tech./dosim.]
  2018 IEEE International Microwave Biomedical Conference (IMBioC), Philadelphia, PA, USA. IEEE: pp. 184-186; ISBN 978-1-5386-5919-9