2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 166-169; ISBN 978-1-7281-1639-6
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Jung SH, Hatcher-Solis C, Moore R, Bechmann N, Harshman S, Martin J, Jankord R