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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
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[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
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2019,
Jamshed MA, Amjad O, Heliot F, Brown T
2019 IEEE Wireless Communications and Networking Conference Workshop (WCNCW), Marrakech, Morocco. IEEE: pp. 1-5; ISBN 978-1-7281-0923-7
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2019,
Yu X, Ren J, Wang J, Du J, Ma J, Ren Y
BIBE 2019; The Third International Conference on Biological Information and Biomedical Engineering, Hangzhou, China. VDE: pp. 1-5; ISBN 978-3-8007-5026-9
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2019,
D'Anci KE, Uhl S, Oristaglio J, Sullivan N, Tsou AY
Ann Intern Med 171 (12): 906-915
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2019,
Tremblay SA, Chapman CA, Courtemanche R
Front Syst Neurosci 13: 60
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2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
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2019,
Steele VR, Maxwell AM, Ross TJ, Stein EA, Salmeron BJ
Front Neurosci 13: 1147
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2019,
Azizi SMY, Hosseini Sarghein S, Majd A, Peyvandi M
Physiol Mol Biol Plants 25 (6): 1445-1456
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2019,
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Fachverband für Strahlenschutz e. V. (FS),
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2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
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2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: pp. 1-5; ISBN 978-1-7281-1899-4
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2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: pp. 1-3; ISBN 978-1-7281-2063-8
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 43-46; ISBN 978-1-7281-1639-6
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2019,
Brinda K, Kumar Palaniswamy S, Priyadharshini N, Keerthi C S, Prasanth DS, Agarwal R
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: pp. 1-4; ISBN 978-1-5386-9354-4
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: pp. 158-161; ISBN 978-1-7281-2570-1
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2019,
Ji X, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 527-528; ISBN 978-1-7281-0693-9
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2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
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2019,
Ebadi-Shahrivar A, Fay P, Hochwald BM, Love DJ
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 1005-1006; ISBN 978-1-7281-0693-9
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2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 1861-1862; ISBN 978-1-7281-0693-9
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2019,
Song S, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: pp. 1009-1010; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
