-
2023,
Varshney A, Semwal A, Chandra Yadav A, Mahto K, Sangwan D, Bhattarai S, Tyagi AK
Cureus 15 (9): e45443
-
2023,
Gilles F, Nicot F, Boyer C, Georges JL
BMJ Case Rep 16 (10): e257010
-
2023,
Qu H, Wang Y, Wang B, Li C
BMC Microbiol 23 (1): 290
-
2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
-
Chin J Burns Wounds 39 (8): 718-723
-
2023,
Kursawe M, Kaifie A, Krabbe J, Kimpeler S, Kühn R, Kraus T, Jankowiak K
Sci Rep 13: 16320
-
2023,
Morosanu V, Balasa R, Morosanu S, Baróti B, Roman-Filip I
Cureus 15 (8): e43951
-
Acta Chir Plast 65 (2): 66-69
-
2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
-
2023,
Huber P, Mohanty P, Jenau F
2023 IEEE Electrical Insulation Conference (EIC), Quebec City, QC, Canada. IEEE: 1-4; ISBN 978-1-6654-9342-0