2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
2024,
Mondaini N, Gacci M, Cai T, Lotti F, Li Marzi V, Crocerossa F, Cantiello F, Tanguenza S, Comito A, Fusco I, Pennati B, Damiano R