-
International Electrotechnical Commission (IEC),
IEC 62232:2017: 1-516, ISBN 978-2-8-3226302-0
-
International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.113 (2015) Err. 1 (10/2017)
-
2017,
Stankovic V, Jovanovic D, Krstic D, Markovic V, Dunjic M
Vojnosanit Pregl 74 (9): 854-861
-
2017,
Dianah ARSN, Hazmin SN, Umar R, Kamarudin MKA, Dagang AN
J Fund App Sci 9 (2S): 182-198
-
Int J Adv Comput Sci Appl 8 (11): 223–235
-
2017,
Kurnaz C, Yildiz D, Karagöl S
2017 18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF) Book of Abstracts, Lodz, Poland. IEEE: 1-2; ISBN 978-1-5386-1662-8
-
2017,
Ostafin M, Miernik A, Drozdz T, Nawara P, Gliniak M, Kielbasa P, Tabor S
2017 Progress in Applied Electrical Engineering (PAEE), Koscielisko, Poland. IEEE: 1-5; ISBN 978-1-5386-1529-4
-
2017,
Mittal L, Raman V, Camarillo IG, Garner AL, Fairbanks AJ, Dunn GA, Sundararajan R
2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), Fort Worth, TX, USA. IEEE: 596-599; ISBN 978-1-5386-1195-1
-
2017,
Mi Y, Xu J, Tang X, Yao C, Li C
IEEE Trans Dielectr Electr Insul 24 (6): 3985 - 3994
-
2017,
Ozen S, Carlak HF, Colak OH, Helhel S
2017 Progress In Electromagnetics Research Symposium - Spring (PIERS), St. Petersburg, Russia. IEEE: 1743-1746; ISBN 978-1-5090-6270-6