キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
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2023,
Yin B, Joseph W, Deruyck M
IEEE Access 11: 115911-115923
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2023,
Govindan T, Palaniswamy SK, Kanagasabai M, Kumar S, Agarwal R, Kumar R, Panigrahy D
IEEE Sens J 23 (22): 28150-28158
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2023,
Gombarska D, Smetana M, Psenakova Z, Boleckova S
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: pp. 1-4; ISBN 9798350330359
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2023,
Fang Y, Liu Y, Zhu JQ, Jia Y
2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT), Qingdao, China. IEEE: pp. 1-3; ISBN 9798350338881
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2023,
Adda S, Chiaraviglio L, Franci D, Lodovisi C, Pasquino N, Pavoncello S, Pedroli C, Pelosini R
IEEE Trans Instrum Meas 72: 5504410
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: pp. 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-6; ISBN 9798350301076
