キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
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2023,
Soares NE, Bulla G, Fernandez-Rodriguez CE, De Salles AAA
2023 IEEE MTT-S Latin America Microwave Conference (LAMC), San José, Costa Rica. IEEE: pp. 58-60; ISBN 9798350316414
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
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2023,
Rehman M, Mirsaeidi S, Nor NM, Koondhar MA, Zainuri MAAM, Alaas ZM, Tag-Eldin E, Ghamry NA, Ahmed MMR
IEEE Access 11: 144978-145010
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-5; ISBN 9798350333114
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-4; ISBN 9798350333114
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2023,
Li C, Sha S, Zhao H, Xing L, Xu Q
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: pp. 1-3; ISBN 9798350333114
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2023,
Li H, Cui K, Wang Y, Chen G
2023 Light Conference, Changchun, China. IEEE: pp. 1-5; ISBN 9798350327175
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2023,
Costanzo S, Flores A
2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: pp. 1-4; ISBN 9798350313024
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2023,
Al Salameh MSH, Al-Zughool MR
2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: pp. 1-4; ISBN 9798350313024
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2023,
Lodi MB, Makridis A, Kazeli K, Samaras T, Angelakeris M, Muntoni G, Fanti A, Mazzarella G
2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: pp. 1-4; ISBN 9798350313024