キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
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2024,
Mishra M, Tiwari G, Gupta PK, Kumar A, Mukherjee B
IEEE Sens Lett [in press]
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2024,
González AM, Morcillo AD, Martínez ML, Temnani A, Reyes PB, García SZ
IEEE Access 12: 152087-152096
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2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 186-189; ISBN 9798331506094
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2024,
Nozadze T, Kharshiladze D, Jeladze V, Ghvedashvili G, Zaridze R
2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 175-179; ISBN 9798331506094
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2024,
Yao M, Wei Z, Li K, Pedersen GF, Zhang S
IEEE Trans Antennas Propag [in press]
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2024,
Nozadze T, Haueisen J, Jeladze V
2024 IEEE 29th International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED), Tbilisi, Georgia. IEEE: pp. 180-185; ISBN 9798331506094
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2024,
Chiao JC, Bing S, Chawang K, Crowe B
IEEE Antennas Propag Mag 66 (5): 66-76
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2024,
Zuo Z, Wang Q, Zheng J, Jeong H, Kumar A, Chen J
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 369-373; ISBN 9798350360400
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2024,
Huang X, Scoles S, Nguyen P, Chen J, Wisniewski J, Wan Y, Jiang GJ
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400
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2024,
Lee C, Rhee J, Lee S, Kwon H, Park Y, Shin Y, Ahn S
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 604-607; ISBN 9798350360400