キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
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2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: 1-3; ISBN 978-1-7281-6065-8
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2020,
Supriya A, Ashok Kumar S, Shanmuganantham T
2020 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT), Bangalore, India. IEEE: 1-3; ISBN 978-1-7281-6829-6
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2020 Wireless Telecommunications Symposium (WTS), Washington, DC, USA. IEEE: 1-5; ISBN 978-1-7281-4696-6
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2020,
Agudelo DA, Chávez JS, Ramírez JS, Araque JL
2020 International Applied Computational Electromagnetics Society Symposium (ACES), Monterey, CA, USA. IEEE: 1-2; ISBN 978-1-7281-6285-0
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0