キーワード:
米国電気電子学会, "Institute of Electrical and Electronics Engineers", IEEE
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2023,
Adda S, Aureli T, D’elia S, Franci D, Pasquino N, Pavoncello S, Suman R
IEEE Trans Instrum Meas 72: 1-9
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2023,
Choudhary R, Kumar V
2023 International Conference on Computational Intelligence, Communication Technology and Networking (CICTN), Ghaziabad, India. IEEE: pp. 154-159; ISBN 9798350338034
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[生体材料への電磁波の影響]
[tech./dosim.]
2023 International Conference on Computational Intelligence, Communication Technology and Networking (CICTN), Ghaziabad, India. IEEE: pp. 149-153; ISBN 9798350338034
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2023,
Liu S, Onishi T, Taki M, Watanabe S
IEEE Trans Antennas Propag 71 (7): 6098-6110
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2023,
Gundre SB, Ratnaparkhe VR
2023 2nd International Conference on Paradigm Shifts in Communications Embedded Systems, Machine Learning and Signal Processing (PCEMS), Nagpur, India. IEEE: pp. 1-5; ISBN 9798350310726
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2023,
Ramesh Varma D, Murali M, Vamshi Krishna M, Raju GSN
2023 2nd International Conference on Paradigm Shifts in Communications Embedded Systems, Machine Learning and Signal Processing (PCEMS), Nagpur, India. IEEE: pp. 1-6; ISBN 9798350310726
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2023,
Anwar U, Arslan T, Hussain A, Russ TC, Lomax P
IEEE Trans Biomed Circuits Syst 17 (5): 928-940
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2023,
Goswami C, Grover P
IEEE Trans Biomed Eng 70 (12): 3300-3311
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2023,
Gao Y, Qi D, Li C, Zhao H
2023 4th International Conference on Computer Engineering and Application (ICCEA), Hangzhou, China. IEEE: pp. 56-60; ISBN 9798350347555
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
