キーワード:
比吸収率, "Spezifische Absorptionsrate", SAR, "specific energy absorption rate", "specific absorption rate", 比エネルギー吸収率
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IEEE Trans Electromagn Compat 62 (2): 338-345
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2020,
Boutet A, Hancu I, Saha U, Crawley A, Xu DS, Ranjan M, Hlasny E, Chen R, Foltz W, Sammartino F, Coblentz A, Kucharczyk W, Lozano AM
J Neurosurg 132 (2): 586–594
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2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 2538-2546; ISBN 978-1-7281-3404-8
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2019,
Raj AB, Nesasudha M
2019 2nd International Conference on Signal Processing and Communication (ICSPC), Coimbatore, India. IEEE: pp. 193-197; ISBN 978-1-7281-1850-5
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2019,
Parchin NO, Al-Yasir YIA, Ali AH, Elfergani I, Noras JM, Rodriguez J, Abd-Alhameed RA
IEEE Access 7: 15612-15622
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2019,
Giman FN, Jack Soh P, Al-Hadi AA, Jamlos MF, Lago H, Schreurs D, Abdul Rahim SK, Beyer A
2019 International Applied Computational Electromagnetics Society Symposium (ACES), Miami, FL, USA. IEEE: pp. 1-2; ISBN 978-1-7281-1518-4
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2019,
El Bacha M, Sarkis R
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: pp. 628-636; ISBN 978-1-7281-3404-8
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2019,
Singh T, Singh S, Singh M, Kaur R
2019 International Conference on Issues and Challenges in Intelligent Computing Techniques (ICICT), Ghaziabad, India. IEEE: pp. 1-6; ISBN 978-1-7281-1773-7
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2019,
Hossain A, Hosain MK
2019 1st International Conference on Advances in Science, Engineering and Robotics Technology (ICASERT), Dhaka, Bangladesh. IEEE: pp. 1-5; ISBN 978-1-7281-3446-8
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2019,
Hossain A, Hosain MK
2019 5th International Conference on Advances in Electrical Engineering (ICAEE), Dhaka, Bangladesh. IEEE: pp. 633-637; ISBN 978-1-7281-4935-6
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2019,
Hossain A, Hosain MK
2019 4th International Conference on Electrical Information and Communication Technology (EICT), Khulna, Bangladesh. IEEE: pp. 1-4; ISBN 978-1-7281-6041-2
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2019,
Park J, Jeong M, Shin H, Kim N
2019 IEEE Asia-Pacific Microwave Conference (APMC), Singapore. IEEE: pp. 828-829; ISBN 978-1-7281-3518-2
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2019 7th International Japan-Africa Conference on Electronics, Communications, and Computations, (JAC-ECC), Alexandria, Egypt. IEEE: pp. 132-135; ISBN 978-1-7281-5618-7
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2019 International Conference on Robotics,Electrical and Signal Processing Techniques (ICREST), Dhaka, Bangladesh. IEEE: pp. 253-257; ISBN 978-1-5386-8015-5
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2019,
Rahaman MA, Hossain QD
2019 International Conference on Robotics,Electrical and Signal Processing Techniques (ICREST), Dhaka, Bangladesh. IEEE: pp. 200-204; ISBN 978-1-5386-8015-5
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2019,
Rashid MMU, Rahman A, Paul LC, Rafa J, Podder B, Sarkar AK
2019 International Conference on Computer, Communication, Chemical, Materials and Electronic Engineering (IC4ME2), Rajshahi, Bangladesh. IEEE: pp. 1-6; ISBN 978-1-7281-3061-3
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2019,
Lin J, Ding G, Li J, Xu S, He W
2019 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Nanjing, China. IEEE: pp. 1-3; ISBN 978-1-5386-7396-6
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2019,
Ben Saada A, Ben Mbarek S, Choubani F
2019 15th International Wireless Communications & Mobile Computing Conference (IWCMC), Tangier, Morocco. IEEE: pp. 1430-1433; ISBN 978-1-5386-7748-3
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2019,
Shafaet-Uz-Zaman K, Matin MA
2019 TEQIP III Sponsored International Conference on Microwave Integrated Circuits, Photonics and Wireless Networks (IMICPW), Tiruchirappalli, India. IEEE: pp. 10-14; ISBN 978-1-7281-1882-6
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Zin TT, Lin JCW (eds.): Big Data Analysis and Deep Learning Applications. ICBDL 2018. Advances in Intelligent Systems and Computing, 744巻; Springer, Singapore; pp. 191-198; ISBN 978-981-13-0868-0
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2019,
Jia Y, Mirbozorgi SA, Lee B, Khan W, Madi F, Inan OT, Weber A, Li W, Ghovanloo M
IEEE Trans Biomed Circuits Syst 13 (4): 608-618
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2019,
Mohanarangam K, Kim MG, Choi JR
2019 16th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Lausanne, Switzerland. IEEE: pp. 145-148; ISBN 978-1-7281-1202-2
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2019,
Jiang W, Cui Y, Liu B, Hu W, Xi Y
IEEE Access 7: 112554-112563
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2019,
Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
IEEE Trans Electromagn Compat 61 (5): 1423-1431
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2019,
Higashibata S, Murakami Y, Arima T, Uno T
IEICE Commun Express 8 (8): 359-362