2024,
Kim YJ, Kent N, Vargas Paniagua E, Driscoll N, Tabet A, Koehler F, Malkin E, Frey E, Manthey M, Sahasrabudhe A, Cannon TM, Nagao K, Mankus D, Bisher M, de Nola G, Lytton-Jean A, Signorelli L, Gregurec D, Anikeeva P
2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA. IEEE: pp. 365-368; ISBN 9798350360400