EMF-Portal | 文献検索結果

2018, Bagheri L, Pellati A, Rizzo P, Aquila G, Massari L, De Mattei M, Ongaro A

[パルス化電磁界によって誘導されたヒト骨髄間葉系幹細胞の骨形成分化の際にはNotch経路が活性化する] [med./bio.]

J Tissue Eng Regen Med 12 (2): 304-315

2018, Arjmand M, Ardeshirylajimi A, Maghsoudi H, Azadian E

[パルス化電磁界の存在下で改善されたナノファイバー足場上で培養した間葉系幹細胞の骨形成分化の潜在能力] [med./bio.]

J Cell Physiol 233 (2): 1061-1070

2017, Airò M, Ala G, Buccheri P, Caruso M, Fascella G, Giovino A, Mammano MM

Effect of weak magnetic fields on the in vitro propagation of Genista aetnensis (Raf. Ex Biv.) Dc. [med./bio.]

Beruto M, Ozudogru EA (eds.): VI International Symposium on Production and Establishment of Micropropagated Plants. Acta Horticulturae, 1155巻; ISHS; pp. 387-392; ISBN 978-94-6261-151-1

2017, Taghvaee H, Habibi A, Rezaee A, Zarinkhat F

Low Profile UHF Loop Antenna Prototyped and Investigated by Circuit Modeling [tech./dosim.]

Microw and Opt Tech Letters 59 (2): 459-463

2017, Dukic V, Miladinov Z, Dozet G, Cvijanovic M, Tatic M, Miladinovic J, Balesevic-Tubic S

Pulsed electromagnetic field - a cultivation practice used to increase soybean seed germination and yield [med./bio.]

Zemdirbyste-Agriculture 104 (4): 345-352

2017, See CH, Abd-Alhameed RA, Mirza AF, McEwan NJ, Excell PS, Balzano Q

Mathematical Model for Calibration of Potential Detection of Nonlinear Responses in Biological Media Exposed to RF Energy [tech./dosim.]

Appl Comput Electromagn Soc J 32 (1): 1-7

2017, Bonea A

Technological anxieties: telecom towers and public health controversies in urban India [risk]

Contemp South Asia 25 (2): 196-211

2017, Ivan L, Fernandez-Ardevol M

Older People, Mobile Communication and Risks [risk]

Societies 7 (2): 7

2017, Letuta UG, Avdeeva EI

Magnetic-dependent ATP pool in Escherichia coli [med./bio.]

Dokl Biochem Biophys 474: 196-199

2017, Kurnaz C, Yildiz D, Karagöl S

Assessment of short/long term electric field strength measurements for a pilot district [tech./dosim.]

2017 18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF) Book of Abstracts, Lodz, Poland. IEEE: pp. 1-2; ISBN 978-1-5386-1662-8