-
2019,
Diao Y, Gomez-Tames J, Rashed EA, Kavet R, Hirata A
IEEE Access 7: 184320-184331
-
2019,
Kwate RK, Derkaoui A, Elmagroud B, Taybi C, Ziyyat A, Picard D
2019 7th Mediterranean Congress of Telecommunications (CMT), Fez, Morocco. IEEE: pp. 1-4; ISBN 978-1-7281-4421-4
-
2019,
Bejenaru O, Lazarescu C, Salceanu A, David V
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-4012-4
-
2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
-
2019,
Fernández-Rodríguez C, Bulla G, de Salles AA
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: pp. 264-267; ISBN 978-1-7281-1798-0
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
-
[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
-
2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
