-
2022,
Zhou H, Zhang R, Tian Y, Peng H, Wang H, Mao J
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Urbana, IL, USA. IEEE: pp. 1-3; ISBN 978-1-6654-9195-2
-
2022,
Zhang J, Du C, Wang R
Micromachines 13 (12): 2141
-
2022,
Nourredine T, Rabah D, Abdechafik H
2022 19th International Multi-Conference on Systems, Signals & Devices (SSD), Sétif, Algeria. IEEE: pp. 1813-1819; ISBN 978-1-6654-7109-1
-
2022,
Chen Y, Lu C, Shang X, Wu K, Chen K
Front Pharmacol 13: 1062119
-
2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
-
Sensors 22 (23): 9257
-
2022,
Chountala C, Chareau JM, Baldini G, Bonavitacola F
2022 9th International Conference on Wireless Networks and Mobile Communications (WINCOM), Rabat, Morocco. IEEE: pp. 1-6; ISBN 978-1-6654-5277-9
-
2022,
Wydaeghe R, Shikhantsov S, Tanghe E, Vermeeren G, Martens L, Demeester P, Joseph W
IEEE Access 10: 130996-131004
-
2022,
Umamaheswari G, Praveena A
2022 International Conference on Intelligent Innovations in Engineering and Technology (ICIIET), Coimbatore, India. IEEE: pp. 118-123; ISBN 978-1-6654-5654-8
-
2022,
Salem MA, Lim HS, Chua MY, Chien SF, Zarakovitis CC, Ng CY, Abd Rahman NZ
Int J Technol 13 (6): 1298-1307