-
2019,
Gou W, Xia G, Feng Z
Liu L, Yang C, Ke J (eds.): Advances In Materials, Machinery, Electronics III: 3rd International Conference on Advances in Materials, Machinery, Electronics (AMME 2019): Wuhan, China. AIP Conference Proceedings, 2073巻; AIP Publishing, Melville, New York; 020069; ISBN 978-0-7354-1801-1
-
2019,
Chen Y, Cai Z, Feng Q, Gao P, Yang Y, Bai X, Tang BQ
Cogent Biol 5 (1): 1625104
-
2019,
Syrek P, Skowron M, Ciesla A
2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: 1-4; ISBN 978-1-7281-0102-6
-
2019,
Maharjan R, Bae S, Kim GH, Yoon Y, Jang Y, Kim Y, Yi H
Entomol Res 49 (5): 214-222
-
German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 50527-2-2 VDE 0848-527-2-2:2019-11
-
German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 50364 VDE 0848-364:2019-05
-
2019,
Shalaby M, Shokair M, Messiha NW
Iran J Sci Technol-Trans Electr Eng 43 Suppl 1: 1-14
-
German Social Accident Insurance (DGUV),
IFA Report, 1/2019: 1-211, ISBN 978-3-86423-237-4
-
2019,
Pratiwi R, Antara NY, Fadliansyah LG, Ardiansyah SA, Nurhidayat L, Sholikhah EN, Sunarti S, Widyarini S, Fadhlurrahman AG, Fatmasari H, Tunjung WAS, Haryana SM, Alamsyah F, Taruno WP
F1000Res 8: 1770
-
2019,
Vrabec TL, Eggers TE, Foldes EL, Ackermann DM, Kilgore KL, Bhadra N
J Neuroeng Rehabil 16: 80