文献検索結果

710件の論文が見つかりました。

キーワード: "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility", 電磁両立性

• 2019, Bieth F, Delmote P, Schneider M
  Electromagnetic Compatibility of a Railgun Implemented on a Warship [tech./dosim.]
  IEEE Trans Plasma Sci 47 (6): 2987-2994
• 2019, Liu J, Zheng J, Zeng Q, Wang Q, Rondoni J, Olsen J, Kainz W, Chen J
  Investigations on Tissue-Simulating Medium for MRI RF Safety Assessment for Patients With Active Implantable Medical Devices [tech./dosim.]
  IEEE Trans Electromagn Compat 61 (4): 1091-1097
• 2019, Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
  Measurement and Numerical Modelling of Electric Field in Open Type Air Substation [tech./dosim.]
  J Sci Arts No.1 (46): 249-259
• 2019, Zeng Q, Liu J, Angelone LM, Lloyd T, Wedan S, Chen J, Kainz W
  Investigation of RF-Induced Heating Near Interventional Catheters at 1.5 T MRI: A Combined Modeling and Experimental Study [dev./impl.]
  IEEE Trans Electromagn Compat 61 (5): 1423-1431
• 2019, Botsa VR, Kumar Munaka S, Dushyanth M, Bandaru S
  [インド最大のEMP［電磁パルス］施設の電磁界均質性およびQuite Zone] [tech./dosim.]
  2019 IEEE 5th Global Electromagnetic Compatibility Conference (GEMCCON), Bangalore, India. IEEE: pp. 1-4; ISBN 978-1-7281-4153-4
• 2019, Katkoria V, Ghosh P, Chaudhury B
  [GPUはFDTDベースのオープンソースSARシミュレータを加速する] [tech./dosim.]
  2019 IEEE MTT-S International Microwave and RF Conference (IMARC), Mumbai, India. IEEE: pp. 1-5; ISBN 978-1-7281-4041-4
• 2019, Wang Y, Wen Y
  [リニア同期モーターによる磁気浮上式列車の電磁放射] [tech./dosim.]
  2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: pp. 1507-1512; ISBN 978-1-7281-1676-1
• 2019, Cruciani S, Campi T, Maradei F, Feliziani M
  [電気自動車のワイヤレス充電：アクティブコイルによるペースメーカーのEMI／EMC［電磁障害／電磁両立正］リスクの軽減] [tech./dosim.]
  2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), London, United Kingdom. IEEE: pp. 173-176; ISBN 978-1-7281-0881-0
• 2019, Geyikoglu MD, Koc Polat H, Cavusoglu B
  [骨がんの温熱療法のための新規の柔軟なアンテナアレイ設計] [tech./dosim.]
  2019 Fifth International Electromagnetic Compatibility Conference (EMC Turkiye), Kocaeli, Turkey. IEEE: pp. 1-5; ISBN 978-1-7281-1836-9
• 2019, Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
  [Comsolを用いたMri互換超音波トランスデューサー層複合材の最適化の予備的研究] [dev./impl.]
  2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: pp. 1-5; ISBN 978-1-7281-4853-3