キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Simonazzi M, Sandrolini L, Reggiani U
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2020,
Song X, Yue Y, Zhu X, Chang H
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Bonato M, Dossi L, Chiaramello E, Fiocchi S, Gallucci S, Tognola G, Ravazzani P, Parazzini M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Miwa K, Takenaka T, Hirata A
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Onishi T, Niskala K, Christ A, Roman J
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Gravina A, Moglie F, Bastianelli L, Mariani Primiani V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-7281-5580-7
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2020,
Cruciani S, Campi T, Maradei F, Feliziani M
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Kamimura Y, Daimon K, Matsumoto N, Kimura S, Sato K
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: 1-6; ISBN 978-1-7281-7363-4
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2020,
Asadi R, Aliakbarian H, Khayambashi G, Majdolashrafi P
IEEE Electromagn Compat Mag 9 (3): 45-54
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2020,
Dinarević EC, Poljak D, Blažević Z
2020 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Hvar, Croatia. IEEE: 1-4; ISBN 978-1-7281-7538-6
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IEEE Electromagn Compat Mag 9 (3): 96-99
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2020,
Xia M, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 257-260; ISBN 978-1-7281-7431-0
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2020,
Fiedler TM, Ladd ME, Clemens M, Bitz AK
IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
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2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
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2020,
Hong S, Jeong S, Lee S, Sim B, Kim H, Kim J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 623-625; ISBN 978-1-7281-7431-0
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
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2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 266-269; ISBN 978-1-7281-7431-0
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 659-662; ISBN 978-1-7281-7431-0
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: 1-6; ISBN 978-1-7281-7543-0
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2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618