キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 354-359; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 348-353; ISBN 978-4-88552-287-1
-
2014,
Haridim M, Levin B, Revich S, Chulski S, Sauleau R, Zemach R
IEEE Electromagn Compat Mag 3 (4): 43-48
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 745-748; ISBN 978-4-88552-287-1
-
2014,
Diao YL, Sun WN, Chan KH, Leung SW, Siu YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 226-229; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 202-205; ISBN 978-4-88552-287-1
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 537-540; ISBN 978-4-88552-287-1
-
2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 186-189; ISBN 978-4-88552-287-1
