キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
Catarinucci L, Palazzari P, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 959-964; ISBN 978-4-88552-287-1
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2014,
Borio E, Crotti G, Rinaudo A, Scaglione M, Spisani A, Zucca M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1035-1039; ISBN 978-4-88552-287-1
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2014,
Haga A, Matsuki H, Endo G
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 997-1001; ISBN 978-4-88552-287-1
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2014,
Sacco B, Scotti A, Confalonieri C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Mizuno Y, Naito K, Isaka K, Yonemura I, Hasekura H
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1009-1014; ISBN 978-4-88552-287-1
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2014,
D'Inzeo G, Apollonio F, Liberti M, Ardoino L, Lovisolo GA
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 981-984; ISBN 978-4-88552-287-1
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2014,
Mori F, Sorrentino R, Strappini M, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Cortina R, Masetti C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bellan B, Betti P, Carillo D, D’Amore M, D’Arco M, De Capua C, Gaggelli A, Grandolfo M, Maradei F, Mariscotti A, Pignari S, Pozzobon P, Rossi P, Violi AG
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1201-1204; ISBN 978-4-88552-287-1
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2014,
Poljak D, Sarolic A, Roje V
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 965-968; ISBN 978-4-88552-287-1