キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2019,
Wang Q, Li W, Kang J, Wang Y
IEEE Trans Electromagn Compat 61 (6): 1913 - 1925
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2019,
Trigui A, Hached S, Ammari AC, Savaria Y, Sawan M
IEEE Rev Biomed Eng 12: 72-87
-
2019,
Pfeifer S, Carrasco E, Crespo-Valero P, Neufeld E, Kühn S, Samaras T, Christ A, Capstick MH, Kuster N
IEEE Trans Electromagn Compat 61 (2): 476 - 486
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2019,
Xu B, Gustafsson M, Shi S, Zhao K, Ying Z, He S
IEEE Trans Electromagn Compat 61 (2): 327 - 336
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2019,
Ängskog P, Bäckström M, Samuelsson C, Kangashaka Vallhagen B
IEEE Trans Electromagn Compat 61 (3): 870 - 877
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2019,
Wang J, Li Q, Cai L, Zhou M, Xiao J, Šunjerga A
IEEE Trans Electromagn Compat 61 (2): 440 - 448
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2018,
Huang X, Wang Z, Chen J, Zheng J
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA. IEEE: pp. 280-285; ISBN 978-1-5386-6622-7
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2018,
Qi Y, Wu J, Gong G, Fan J, Orlandi A, Yu W, Ma J, Drewniak JL
IEEE Trans Electromagn Compat 60 (5): 1152-1160
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2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: pp. 184-189; ISBN 978-1-4673-9699-8
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2018,
Monti G, Masotti D, Paolini G, Corchia L, Costanzo A, Dionigi M, Mastri F, Mongiardo M, Sorrentino R, Tarricone L
IEEE Electromagn Compat Mag 7 (1): 67-77