キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2019,
Rathebe PC, Mbonane TP
2018 IEEE 4th Global Electromagnetic Compatibility Conference (GEMCCON), Stellenbosch, South Africa. IEEE: pp. 1-3; ISBN 978-1-5386-5729-4
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2019,
Nefzi A, Lemercier CE, El Khoueiry C, Lewis N, Lagroye I, Boucsein C, Leveque P, Arnaud-Cormos D
2019 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Nanjing, China. IEEE: pp. 1-3; ISBN 978-1-5386-7396-6
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2019,
Li X, Zhu F, Lu H, Qiu R, Tang Y
IEEE Trans Electromagn Compat 61 (2): 319 - 326
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2019,
Atefi SR, Serano P, Poulsen C, Angelone LM, Bonmassar G
IEEE Trans Electromagn Compat 61 (3): 852-859
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2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: pp. 1-5; ISBN 978-1-7281-0102-6
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2019,
Campi T, Cruciani S, Maradei F, Feliziani M
IEEE Trans Electromagn Compat 61 (6): 1935 - 1943
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2019,
Zhou Y, Zhang W, Yu H
Zhongguo Yi Liao Qi Xie Za Zhi 43 (2): 94-98
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2019,
Omi S, Uno T, Arima T, Wiart J
IEEE Trans Electromagn Compat 61 (1): 48 - 56
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2019,
Yang R, Zheng J, Wang Y, Guo R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (6): 1726 - 1732
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2019,
Ji X, Zheng J, Yang R, Kainz W, Chen J
IEEE Trans Electromagn Compat 61 (1): 57 - 64