キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: pp. 659-662; ISBN 978-1-7281-7431-0
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2020,
Richter A, Ferková Z, Morava J
2020 ELEKTRO, Taormina, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-7543-0
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2020,
Gao Z, Zhang W, Chen X
Zhongguo Yi Liao Qi Xie Za Zhi 44 (4): 302-306
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2020,
Azaro R, Gandolfo A
IEEE Trans Electromagn Compat 62 (4): 1611-1618
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2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: pp. 1-5; ISBN 978-1-7281-4591-4
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IEEE Electromagn Compat Mag 9 (2): 27-29
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IEEE Trans Electromagn Compat 62 (4): 1443-1450
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2020,
Brizi D, Fontana N, Tucci M, Barmada S, Monorchio A
IEEE Trans Electromagn Compat 62 (4): 1312-1322
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2020,
Rashed EA, Diao Y, Tanaka S, Sakai T, Gomez-Tames J, Hirata A
IEEE Trans Electromagn Compat 62 (6): 2704-2713
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2020,
Gusarov AV, Rostovtsev VL, Safonov LV, Shurygin SN
Zh Nevrol Psikhiatr Im S S Korsakova 120 (2): 76-80
