キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014,
D'Inzeo G, Apollonio F, Liberti M, Ardoino L, Lovisolo GA
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 981-984; ISBN 978-4-88552-287-1
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2014,
Mori F, Sorrentino R, Strappini M, Tarricone L
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Cortina R, Masetti C
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bellan B, Betti P, Carillo D, D’Amore M, D’Arco M, De Capua C, Gaggelli A, Grandolfo M, Maradei F, Mariscotti A, Pignari S, Pozzobon P, Rossi P, Violi AG
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1201-1204; ISBN 978-4-88552-287-1
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2014,
Poljak D, Sarolic A, Roje V
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 965-968; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-21; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 751-756; ISBN 978-4-88552-287-1
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2014,
Bit-Babik G, Faraone A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Sarolic A, Modlic B, Roje V, Poljak D, Pavic P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 969-973; ISBN 978-4-88552-287-1
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2014,
Bitz A, Alaydrus M, Streckert J, Hansen VW
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 747-750; ISBN 978-4-88552-287-1
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2014,
Ruffilli L, D'Elia S, Barabino A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Flintoft ID, Porter SJ, Capstick MH, Marvin AC
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Herschlein A, Baldauf M, Sörgel W, Wiesbeck W
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-4; ISBN 978-4-88552-287-1
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2014,
Bernardi P, Cicchetti R, Testa O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-6; ISBN 978-4-88552-287-1
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2014,
Bernardi P, Cavagnaro M, Pisa S, Piuzzi E
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: pp. 1-5; ISBN 978-4-88552-287-1
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2014,
Carsimamovic A, Mujezinovic A, Carsimamovic S, Muharemovic A, Bajramovic Z
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 611-614; ISBN 978-1-4799-3226-9
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2014,
Laissaoui AM, Nekhoul B, Poljak D, Kerroum K, Drissi KE
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 974-979; ISBN 978-1-4799-3226-9
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2014,
Yngve Hamnerius, Tomas Nilsson
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 364-368; ISBN 978-1-4799-3226-9
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2014,
Döbbelin R, Förster S, Lindemann A
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 369-374; ISBN 978-1-4799-3226-9
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2014,
Lisewski T, Luszcz J
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: pp. 360-363; ISBN 978-1-4799-3226-9
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2014,
Kavya M, Yashodhara B, Arunachalam V, Devendranath D, Yellaiah A, Rashmi, Sailaja RRN
2014 International Conference on Power Signals Control and Computations (EPSCICON), Thrissur, India. IEEE: pp. 1-6
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2014,
Ptitsyna NG, Ponzetto A, Kopytenko YA, Ismagilov VS, Korobeinikov AG
J Sci Res Rep 3 (13): 1753 - 1770
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2014,
Marshman CA, Armstrong R, Dawson L, Rowell AJ, Ruddle AR
5th IET Hybrid and Electric Vehicles Conference (HEVC 2014), London, UK. IET: p. 14737980; ISBN 978-1-84919-911-7